The required investment to bring an InP wafer in a short time at high temperatures and cool down quickly. usually start Lampenarays that take over the heater. For the required cooling rates, a cooling position will be necessary, which must be approached automatically after process stop. The mainly used temperature range is between 350 ° C and 650 ° C. Overall, however, the system should cover the range from 300 ° C to 900 ° C. To temper in the same facility and diffuse, the wafers to be processed in a box. they may have to wafer of 1x2 pick up "to 1x4". In principle, the system must also be expandable to 1x6 ".
For temperature control, a second measuring system in the facility must be present or external control procedures are included in order to check the temperature constancy regularly.
to be constituted:
- Tools Lot 1;
- Portable machines with accessories Lot 2;
- Magnifying glass lamps Lot 3;
- Work gloves Lot 4;
- industrial vacuum cleaner with accessories Lot 5;
- pallets and pallet Accessories Lot 6;
- archival boxes Lot 7;
- microfibre cloths Los 8th
Tape 20, cutter 50 pieces, 10 pieces drill set, driver set 10 pieces, rear wall screws 9 000, body discs 9 000 pieces.
Akkubohrschrauber with accessories 5 pieces, Torx Various Bits 90 pieces, bit holder 5 pieces, bits set 15 pieces, 3 pieces Pendulum, jigsaw blades 50 pieces.
Fine knit gloves sizes S-XL.
S: 200 pair;
M: 200 pair;
L: 250 pairs;
XL: 200 pairs.
Material glove: polyamide.
Industrial vacuum cleaner with asbestos authorization 6 pieces, industrial vacuum cleaner dust class M 2 pieces,
Vacuum cleaner accessories: filters for industrial vacuum cleaners with asbestos authorization 6 pieces, filters for industrial vacuum cleaner dust Class M 4 pieces, filter bag for industrial vacuum cleaner dust class M 10 pieces, security filter bag for industrial vacuum cleaners with asbestos admission 30 pieces,
Suction 6 pieces,
Extension tube 3 pieces,
Suction brush 30 pieces.
Euro pallets 750 pieces, industrial pallets 100 pieces, large pallets various sizes insgs. 250 pieces, special pallets heavy loads 46.03 m², pallet attachment frame 540 pieces, lid / shelves for stacking frame 500 pieces.
Archive boxes with lids different sizes in total 1 000 pieces, cover folders 200 pieces, 200 pieces telescope-type box, carton blank 200 pieces.
- Colour Blue;
- 1000 pieces.
The laser tracker to be purchased to be used for high-precision detection of the end effector position of industrial robots as well as for position detection distinctive structure points at the IPK. Furthermore, the device for commissioning and design of prototypes as a universal and highly precise instrument is planned to be used.
— 2 Stk. 19" OS-Server,
— 2 Stk. 19" ES-Server,
— 3 Stk. 19" OS-Client,
— 1 Stk. OS-Software Redundant Server,
— 204 Stk. OS-Software Runtime Lizenzen 100 PO,
— 98 Stk. ES-Software Runtime-Lizenz 100 PO,
— 2 000 Stk. Archivariablen,
— 1 x Migration PCS 7 Teilprojekt ZKB 1 – 6 in das Multiprojekt 1. Bio,
— 17 x Kompl. Projektierung der PCS 7/OS Anlagenbereiche,
— 25 Stk. Schrankfeld für Automatisierungstechnik,
— 17 Stk. Automatisierungssystem PCS 7 AS 410S,
— 68 Stk. AS-Software Runtime-Lizenzen 100 PO,
— 50 Stk. Kommunikationsprozessor CP 443-5 Extended,
— 36 Stk. Digitale Eingabebaugruppe S7-400 (DE 32),
— 36 Stk. Digitale Ausgabekarte S7-400 (DA 32),
— 17 Stk. Projektierung Automatisierungsprogramm Anlagenbereiche,
— 51 Stk. Projektierung und Einrichtung Feldbussegment,
— 420 Stk. Datenimplementierung Simocode,
— 160 Stk. Prozessbilderstellung Anlagenübersicht,
— 6 Stk. Universal-Stahlblechschrank 19"-Technik,
— 1 Stk. 24 Port, Full Gigabit Ethernet Switch, 19",
— 1 Stk. 16 Port, Full Gigabit Ethernet Switch, 19",
— 68 Stk. Optical-Link-Modul (OLM), Ringmodul,
— 8 Stk. Industrial – WLAN-Access-Point,
— 1 x WLAN Funkausleuchtung,
— ca. 1 600 m LWL Multimode,
— ca. 600 m LWL Singlemode,
— 2 x Pflichtenheft Automatisierung und PLT.
The Fraunhofer Institute for Microstructure of materials and systems IMWS in Halle and the Fraunhofer Institute for Interfacial Engineering and Biotechnology IGB in Stuttgart plan on a1200 cubic meters of hydrogen.
To this end requires the Fraunhofer-Gesellschaft as a new building:300 m
Infirmary 12 m
Experience in planning and approval of industrial plants according to BImSchG would be desirable.It is contemplated that the planning of plant engineering (plant Group 7) is carried out by a total transferee.
is planned the acquisition of an asset for fast electroplating of various metals for high-aspect-ratio bumps and Pillars and for high-density RDLs (redistribution layer) with line / space distances of <1 micron in BEoL (Back End of Line) - module on 300 mm wafers. The plant should have at least four ECD chambers with 200 mm compatibility. In addition, all processes must be included, used for the preparation of electrochemical deposition (z. B. cleaning, activation) and the post-treatment (removal of unwanted metal deposits on the wafer backside) coated wafer. The proposed application requires the automated processing of 300 mm and 200 mm wafers and standard glass wafers and wafer stacks (thinned wafer bonded onto a carrier wafer) having a thickness from 300 to 1500 microns. The input and output stations must be prepared to receive standardized wafer cassettes. Next II.2.4).
The system should also provide the possibility of process control of an analysis of the electrolyte. It is necessary that major components of the metal bath automatically and continuously analyzed and added when required automatically to the bath.
The equipment is used in a clean room (class 1 000) and must meet all the necessary prerequisites. The plant is operated comprise under the particular aspect of research and development services for industrial partners and has in this connection a high level of flexibility and sufficient, proven possible under production conditions of stability and availability. Significant data (Los, process, error, etc.) to be stored in an appropriate manner and make them accessible for further evaluation. The installed base of equipment in this regard in the field must allow a quick transfer of processes and recipes to the semiconductor companies.