1st. Lift-off modules
Fraunhofer Gesellschaft e.V. | Published July 28, 2017 - Deadline August 25, 2017
1st. Lift-off modules The metal nickel or nickel compounds are necessary to produce low-resistance on SiC wafers. Since this metal is neither structurally nashermic nor dry chemical, the so-called lift-off process is used to pattern this metal. In this process, the metal is applied to a patterned photoresist layer, and then the photolac is removed again, and thus the portion of the nickel layer deposited on the patterned photolak. This requires a system with which this can be carried out without problems. Single wafer system for SiC disks with 100 and 150mm (upgradeable to 200mm); Use of environmentally-friendly solvents, high-pressure pump for solvents, recirculation and filtration of solvents, temperature control of solvents, clean room compatibility, computer controlled, CE marking.